A new generation of small form factor SMT connectors with 0.3mm pitch contact spacing has created a dilemma for many Design Engineers who want to take advantage of the small footprint on a new board layout but may need to terminate to a larger pitch interconnect. New connector designs from connector companies such as Hirose (i.e. FH26 & FH35 Series), I-Pex, JAE, JST and Samtec have become very popular because of their low profile and small real estate requirements.

OCP has developed an industry-unique set of 0.3mm pitch FPC transition adapters that offers Designers a solution to take advantage of the most current connector designs without having to incur the cost and time constraints of redesigning other peripheral, legacy interconnects. The number of contacts ranges from a min. of 4 to a maximum of 60.

These FPC adapters are offered in several versions which should accommodate most applications via 3 adapter families: FPC 0.3mm to FPC 0.5mm, 0.8mm or 1.0mm pitch adapter; FPC 0.3mm to a SMT ZIF connector mounted on an FR4 PCB; FPC 0.3mm to bonded ribbon cable(pictured). OCP’s staff can assist Engineers with connector or cable recommendations based on their application requirements.